旭崇 COG 邦定设备(预本压) XCG80-A6

 新闻中心    |      2019-08-18 20:22:26
旭崇 COG 邦定设备(预本压) XCG80-A6

旭崇 COG 邦定设备(预本压) 

XCG80-A6

COG Bonding M/C (Pre-press & Main-press)

 

Application

本产品适用于各种液晶玻璃(LCD GLASS)与驱动IC DRIVER IC)的COGCHIP ON GLASS)的邦定。

广泛应用于:各种液晶屏、触摸屏、贴合生产工艺。

 The machine is used for COG (CHIP ON GLASS) bonding of various liquid crystal glass (LCD GLASS) and drive IC (DRIVER IC).

 Widely use in production process of various liquid crystal glass and touch panel.

 


Details

人机操作界面  Operating Interface

操作控制按钮   Operating Buttons

光栅保护机构  Grating Protection

X-Y-θ 对位机构  Group of X-Y-θ Aligning

校正机构   Correction Device

自动抓取IC 机构   Group of IC Gripping

CCD机构  CCD Group

本压机构  Group of Main-press

背板机构  Back Plate

 

Introduction:

1 人工将IC 料盘放在IC 治具上。

2 IC 预压头通过X-Y-Z 轴将IC 吸附并到达CCD 拍照的上方,拍照完成。

3 人工将玻璃放在平台上,真空吸附,平台到达CCD 上方,人工调节玻璃,对位OK后启动下压。

4 预压完成,平台自动到达本压工位下方,自动下压。

5 下压邦定完成,回到待机位。

6 重复上述动作。

1. Put IC tray on fixture manually.

2. IC pre-press head moves to photographing position after adsorbing IC from tray, photographing finished.

3. Put glass onto platform and attach it by vacuum, then platform moves to photographing position, correcting the position of glass manually then start to pre-press.

4. Platform moves to main-press position automatically after pre-press finishing, and main-press automatically.

5. Main-press finished, platform go back to standby.

6. Repeat the above action.

 

 

Parameters:

输入电源:AC220V 50-60HZ

Input Power: AC220V 50-60HZ

额定功率:3.5KW

Rated Power: 3.5KW

工作气压:0.4-0.8Mpa

Working Pressure: 0.4-0.8Mpa

对位方式:手动对位,CCD下对位

Ways of Aligning: Aligning manually, CCD bottom aligning

安全防护:静电防护+光栅保护+漏电保护

Safety Protection: ESD protection + grating protection + leakage protection

压头机构:压头组(1组预压头,1组本压头)

Group of head: 1 pre-press head, 1 main-press head

LCD载台:进出电机驱动

LCD Platform: Driven by motor

程序控制:松下PLC

Controlling Program: Panasonic PLC

外型尺寸:L1100*W1320*1750MM(不含报警灯)

Dimension: L1100*W1320*H1750MM (exclude alarm lamp)

设备重量:750KG

Weight of Machine: 750KG

 

 

Features:

1 人机操作界面:便捷设定和显示各项参数,如平台进出速度,贴合时间等。

2 操作控制按钮:对常用功能使用按键操作,使用双启动开关,有效保护误操作启动。

3 光栅保护机构:设备运行时光栅保护范围感应到设备暂停运行。

4 X-Y-θ 对位机构:对位平台可通过X-Y-θ 千分尺精准微调对位。

5 校正机构:IC吸取后有初始校正功能。

6 自动抓取IC机构:IC可通过X-Y-Z轴自动抓取,并实现阵列抓取。

7 CCD机构:CCD可通过X-Y-Z微调整进行微调。

8 本压机构:预本压机构分开,实现可自动卷皮,不用人工安放卷皮提高效率。

9 背板机构:实现背板可下加热,并且配有PCB支承结构,更方便维修性作业。

1. Operating interface is convenient to set and indicate all kinds of parameter, such as platform moving speed and pressing time.

2. Using button operation for common functions, and the ways of pressing double “start” button to operate can avoid operating in wrong ways.

3. The machine will stop when foreign matters in the induction zone of grating protection.

4. Platform can achieve precise alignment through X-Y-θ micrometer.

5. Correction device helps to correct the position after adsorbing by gripping group.

6. Group of IC gripping can grip IC automatically in order.

7. CCD group can be fine-tuning through X-Y-Z micrometer.

8. Pre-press and main-press work independently, the machine can collecting silicone rubber automatically that improve efficiency.

9. Back plate with heating function at under part and PCB supporting group is convenient for maintenance reworking.

 

Process:

FOGOLB邦定   FOG, OLB Bonding

FOBPWB邦定   FOB, PWB Bonding

 

Accessories:

感压纸    Sensitive Paper

ACF       ACF

硅胶皮    Silicone rubber

ACF去除液  ACF Remover

无尘布     Dust-free Cloth

酒精       Ethanol

棉棒       Cotton Swab

手套       Gloves

 

 

本文由http://www.s-label.com/xinwenzhongxin/247.html原创,转载请备注出处谢谢配合!

下一篇:哪些螺丝可以使用手持式锁螺丝机上一篇:热压机分类有哪些?